There are various types of semiconductor and IC packages, such as Zig-zag In-line Package (ZIP) and SIP (Single In-line Package).
Regarding the "Zig-zag In-line Package (ZIP)", this article will explain the information below.
- Zig-zag In-line Package (ZIP) Definition
- Types of Zig-zag In-line Package (ZIP)
Zig-zag In-line Package (ZIP) Definition
ZIP stands for "Zig-zag In-line Package".
Zig-zag In-line Package (ZIP) is a package in which the leads come out of one side of the package, the leads alternately zig-zagged out, and the package is for insert mounting.
It is the same as Single In-line Package (SIP) in that the leads come out of one side of the package. However, the Zig-zag In-line Package (ZIP) has a zigzag shape of the lead, which allows the pin pitch to be shortened, thus shortening the long side.
The pin pitch of the Zig-zag In-line Package (ZIP) is 50 mils when the package face is viewed from the front, but 100 mils when it is inserted into the PCB.
Zig-zag In-line Package (ZIP) has 12 to 40 pins.
The number after ZIP indicates the number of pins. For example, ZIP12 means a 12-pin ZIP.
In addition, the package material, etc., changes depending on the English letter preceding the ZIP.
Supplement
- Zig-zag In-line Package (ZIP) is one in which the leads exit from one side of the package and are alternately folded, while Single In-line Package (SIP) is one in which the leads exit from one side of the package and are aligned in a straight line.
- Zig-zag In-line Package (ZIP) was developed as a replacement for the Dual In-line Package (DIP) to increase mounting density. Later, as surface-mount packages were developed, its use became less common, but it is still used in some analog ICs.
Related article
The following article explains the "Single In-line Package (SIP)" and "Dual In-line Package (DIP)" in detail. If you are interested, please check it out from the link below.
Types of ZIP
SDIP
The "S" in front of ZIP stands for "Shrink".
Therefore, "Shrink Zig-zag In-line Package (SZIP)" is a ZIP with a shrunk pin pitch. The same concept applies to other basic packages (SOP, DIP, PGA, etc.).
HDIP
The "H" in front of ZIP stands for "with heat sink".
Therefore, "HZIP" means a "ZIP with heat sink".
P-ZIP
The "P-" in front of ZIP stands for "plastic".
Therefore, "Plastic ZIP (P-ZIP)" means a "ZIP whose package material is plastic".
Summary
In this article, the following information on the "Zig-zag In-line Package (ZIP)" was explained.
- Zig-zag In-line Package (ZIP) Definition
- Types of Zig-zag In-line Package (ZIP)
Thank you for reading.
Related article
The packages of semiconductors (IC and transistor) other than "Zig-zag In-line Package (ZIP)" described in this article are explained in detail in the following article. If you are interested, please check it out from the link below.
- Types of IC Packages
- What is Small Outline Transistor (SOT)?
- What is Small Outline Diode (SOD)?
- What is Transistor Outline (TO)?
- What is Single In-line Package (SIP)?
- What is Dual In-line Package (DIP)?
- What is Small Outline Package (SOP)?
- What is Small Outline Non-leaded package (SON)?
- What is Small Outline J-leaded package (SOJ)?
- What is Quad Flat Package (QFP)?
- What is Quad Flat Non-leaded package (QFN)?
- What is Quad Flat J-leaded package (QFJ)?
- What is Ball Grid Array (BGA)?
- What is Land Grid Array (LGA)?
- What is Pin Grid Array (PGA)?