What is Quad Flat Non-leaded package (QFN)?

There are various types of semiconductor and IC packages, such as Quad Flat Non-leaded package (QFN) and Small Outline Package (SOP).

Regarding the "Quad Flat Non-leaded package (QFN)", this article will explain the information below.

Quad Flat Non-leaded package (QFN) Definition
Types of Quad Flat Non-leaded package (QFN)

Quad Flat Non-leaded package (QFN) Definition

QFN stands for "Quad Flat Non-leaded package".

Quad Flat Non-leaded package (QFN) is a package that has no leads but instead has electrode pads as connection terminals. The electrode pads protrude from four sides of the package.

Since Quad Flat Non-leaded package (QFN) has no leads, the package can be made almost the same size as the chip size.

The "package mounting height", "package material", etc. change depending on the English letter in front of the QFN.

For example, "L" means that the package installation height L is "1.20mm<L≤1.70mm". Therefore, "LQFN" with "L" in front of QFN means QFN with a package installation height of "1.20mm<L≤1.70mm".

Difference between "SON" and "QFN"

The package name changes depending on whether the electrode pads exit from two sides or four sides of the package.

Leads coming out of two sides: Small Outline Non-leaded package (SON)
Leads coming out of four sides: Quad Flat Non-leaded package (QFN)

The following article explains the "Small Outline Non-leaded package (SON)" in detail. If you are interested, please check it out from the link below.

: What is Small Outline Non-leaded package (SON)?
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Difference between "QFP", "QFJ", and "QFN"

The package name changes depending on whether the leads coming out of the four sides of the package are gull wing (L-shaped) leads, J-shaped leads, or electrode pads.

Gull-wing (L-shaped) lead: Quad Flat Package (QFP)
J-shaped lead: Quad Flat J-leaded package (QFJ)
Electrode pad: Quad Flat Non-leaded package (QFN)

The following article explains "Quad Flat Package (QFP)" and "Quad Flat J-leaded package (QFJ)" in detail. If you are interested, please check it out from the link below.

: What is Quad Flat Package (QFP)?
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: What is Quad Flat J-leaded package (QFJ)?
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Types of Quad Flat Non-leaded package (QFN)

LQFN

The "L" in front of QFN means that the package installation height L is "1.20mm < L ≤ 1.70mm".

Therefore, "Low-Profile Quad Flat Non-leaded package (LQFN)" is a QFN with a package installation height of "1.20mm < L ≤ 1.70mm".

TQFN

The "T" in front of QFN means that the package installation height T is "1.00mm < T ≤ 1.20mm".

Therefore, "Thin Quad Flat Non-leaded package (TQFN)" is a QFN with a package installation height of "1.00mm < T ≤ 1.20mm".

VQFN

The "V" in front of QFN means that the package installation height V is "0.80mm < V ≤ 1.00mm".

Therefore, "Very-thin Quad Flat Non-leaded package (VQFN)" is a QFN with a package installation height of "0.80mm < V ≤ 1.00mm".

WQFN

The "W" in front of QFN means that the package installation height W is "0.65mm < W ≤ 0.80mm".

Therefore, "Very-Very-thin Quad Flat Non-leaded package (WQFN)" is a QFN with a package installation height of "0.65mm < W ≤ 0.80mm".

UQFN

The "U" in front of QFN means that the package installation height U is "0.50mm < U ≤ 0.65mm".

Therefore, "Ultra-thin Quad Flat Non-leaded package (UQFN)" is a QFN with a package installation height of "0.50mm < U ≤ 0.65mm"

XQFN

The "X" in front of QFN means that the package installation height X is "X ≤ 0.50mm".

Therefore, "Extra thin Quad Flat Non-leaded package (XQFN)" is a QFN with a package installation height of "X ≤ 0.50mm"

HQFN

The "H" in front of QFN stands for "Heat sink".

Therefore, "HQFN" means a "QFN with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HLQFN

The "H" in front of LQFN stands for "Heat sink".

Therefore, "HLQFN" means a "LQFN with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HTQFN

The "H" in front of TQFN stands for "Heat sink".

Therefore, "HTQFN" means a "TQFN with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HVQFN

The "H" in front of VQFN stands for "Heat sink".

Therefore, "HVQFN" means a "VQFN with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HWQFN

The "H" in front of WQFN stands for "Heat sink".

Therefore, "HWQFN" means a "WQFN with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HUQFN

The "H" in front of UQFN stands for "Heat sink".

Therefore, "HUQFN" means a "UQFN with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HXQFN

The "H" in front of XQFN stands for "Heat sink".

Therefore, "HXQFN" means a "XQFN with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

P-QFN

The "P-" in front of QFN stands for "Plastic".

Therefore, "P-QFN (Plastic QFN)" means a "QFN whose package material is plastic".

C-QFN

The "C-" in front of QFN stands for "Ceramic".

Therefore, "Ceramic QFN (C-QFN)" means a "QFN whose package material is ceramic".

S-QFN

The "S-" in front of QFN stands for "Silicon".

Therefore, "Silicon QFN (S-QFN)" means a "QFN whose package material is silicon".

LCC,CLCC

Lead Chip Carrier (LCC) and Ceramic Lead Chip Carrier (CLCC) are QFN with ceramic package material and correspond to "C-QFN" in the JEITA package code. It was named in the U.S. in the 1980s.

DFN

Dual Flatpack No-leaded (DFN) has electrode pads on two or four sides of the package. Some packages have electrode pads on only one side.

Summary

In this article, the following information on the "Quad Flat Non-leaded package (QFN)" was explained.

Quad Flat Non-leaded package (QFN) Definition
Types of Quad Flat Non-leaded package (QFN)

Thank you for reading.

The packages of semiconductors (IC and transistor) other than "Quad Flat Non-leaded package (QFN)" described in this article are explained in detail in the following article. If you are interested, please check it out from the link below.