There are various types of semiconductor and IC packages, such as Quad Flat Nonleaded package (QFN) and Small Outline Package (SOP).
Regarding the "Quad Flat Nonleaded package (QFN)", this article will explain the information below.
 Quad Flat Nonleaded package (QFN) Definition
 Types of Quad Flat Nonleaded package (QFN)
Quad Flat Nonleaded package (QFN) Definition
QFN stands for "Quad Flat Nonleaded package".
Quad Flat Nonleaded package (QFN) is a package that has no leads but instead has electrode pads as connection terminals. The electrode pads protrude from four sides of the package.
Since Quad Flat Nonleaded package (QFN) has no leads, the package can be made almost the same size as the chip size.
The "package mounting height", "package material", etc. change depending on the English letter in front of the QFN.
For example, "L" means that the package installation height L is "1.20mm<L≤1.70mm". Therefore, "LQFN" with "L" in front of QFN means QFN with a package installation height of "1.20mm<L≤1.70mm".
Difference between "SON" and "QFN"
The package name changes depending on whether the electrode pads exit from two sides or four sides of the package.
 Leads coming out of two sides: Small Outline Nonleaded package (SON)
 Leads coming out of four sides: Quad Flat Nonleaded package (QFN)
The following article explains the "Small Outline Nonleaded package (SON)" in detail. If you are interested, please check it out from the link below.
What is Small Outline Nonleaded package (SON)?
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Difference between "QFP", "QFJ", and "QFN"
The package name changes depending on whether the leads coming out of the four sides of the package are gull wing (Lshaped) leads, Jshaped leads, or electrode pads.
 Gullwing (Lshaped) lead: Quad Flat Package (QFP)
 Jshaped lead: Quad Flat Jleaded package (QFJ)
 Electrode pad: Quad Flat Nonleaded package (QFN)
The following article explains "Quad Flat Package (QFP)" and "Quad Flat Jleaded package (QFJ)" in detail. If you are interested, please check it out from the link below.

What is Quad Flat Package (QFP)?
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What is Quad Flat Jleaded package (QFJ)?
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Types of Quad Flat Nonleaded package (QFN)
LQFN
The "L" in front of QFN means that the package installation height L is "1.20mm < L ≤ 1.70mm".
Therefore, "LowProfile Quad Flat Nonleaded package (LQFN)" is a QFN with a package installation height of "1.20mm < L ≤ 1.70mm".
TQFN
The "T" in front of QFN means that the package installation height T is "1.00mm < T ≤ 1.20mm".
Therefore, "Thin Quad Flat Nonleaded package (TQFN)" is a QFN with a package installation height of "1.00mm < T ≤ 1.20mm".
VQFN
The "V" in front of QFN means that the package installation height V is "0.80mm < V ≤ 1.00mm".
Therefore, "Verythin Quad Flat Nonleaded package (VQFN)" is a QFN with a package installation height of "0.80mm < V ≤ 1.00mm".
WQFN
The "W" in front of QFN means that the package installation height W is "0.65mm < W ≤ 0.80mm".
Therefore, "VeryVerythin Quad Flat Nonleaded package (WQFN)" is a QFN with a package installation height of "0.65mm < W ≤ 0.80mm".
UQFN
The "U" in front of QFN means that the package installation height U is "0.50mm < U ≤ 0.65mm".
Therefore, "Ultrathin Quad Flat Nonleaded package (UQFN)" is a QFN with a package installation height of "0.50mm < U ≤ 0.65mm"
XQFN
The "X" in front of QFN means that the package installation height X is "X ≤ 0.50mm".
Therefore, "Extra thin Quad Flat Nonleaded package (XQFN)" is a QFN with a package installation height of "X ≤ 0.50mm"
HQFN
The "H" in front of QFN stands for "Heat sink".
Therefore, "HQFN" means a "QFN with Heat sink". A heatdissipating surface called a thermal pad is provided on the board mounting side surface.
HLQFN
The "H" in front of LQFN stands for "Heat sink".
Therefore, "HLQFN" means a "LQFN with Heat sink". A heatdissipating surface called a thermal pad is provided on the board mounting side surface.
HTQFN
The "H" in front of TQFN stands for "Heat sink".
Therefore, "HTQFN" means a "TQFN with Heat sink". A heatdissipating surface called a thermal pad is provided on the board mounting side surface.
HVQFN
The "H" in front of VQFN stands for "Heat sink".
Therefore, "HVQFN" means a "VQFN with Heat sink". A heatdissipating surface called a thermal pad is provided on the board mounting side surface.
HWQFN
The "H" in front of WQFN stands for "Heat sink".
Therefore, "HWQFN" means a "WQFN with Heat sink". A heatdissipating surface called a thermal pad is provided on the board mounting side surface.
HUQFN
The "H" in front of UQFN stands for "Heat sink".
Therefore, "HUQFN" means a "UQFN with Heat sink". A heatdissipating surface called a thermal pad is provided on the board mounting side surface.
HXQFN
The "H" in front of XQFN stands for "Heat sink".
Therefore, "HXQFN" means a "XQFN with Heat sink". A heatdissipating surface called a thermal pad is provided on the board mounting side surface.
PQFN
The "P" in front of QFN stands for "Plastic".
Therefore, "PQFN (Plastic QFN)" means a "QFN whose package material is plastic".
CQFN
The "C" in front of QFN stands for "Ceramic".
Therefore, "Ceramic QFN (CQFN)" means a "QFN whose package material is ceramic".
SQFN
The "S" in front of QFN stands for "Silicon".
Therefore, "Silicon QFN (SQFN)" means a "QFN whose package material is silicon".
LCC,CLCC
Lead Chip Carrier (LCC) and Ceramic Lead Chip Carrier (CLCC) are QFN with ceramic package material and correspond to "CQFN" in the JEITA package code. It was named in the U.S. in the 1980s.
DFN
Dual Flatpack Noleaded (DFN) has electrode pads on two or four sides of the package. Some packages have electrode pads on only one side.
Summary
In this article, the following information on the "Quad Flat Nonleaded package (QFN)" was explained.
 Quad Flat Nonleaded package (QFN) Definition
 Types of Quad Flat Nonleaded package (QFN)
Thank you for reading.
Related article
The packages of semiconductors (IC and transistor) other than "Quad Flat Nonleaded package (QFN)" described in this article are explained in detail in the following article. If you are interested, please check it out from the link below.
 Types of IC Packages
 What is Small Outline Transistor (SOT)?
 What is Small Outline Diode (SOD)?
 What is Transistor Outline (TO)?
 What is Single Inline Package (SIP)?
 What is Dual Inline Package (DIP)?
 What is Zigzag Inline Package (ZIP)?
 What is Small Outline Package (SOP)?
 What is Small Outline Nonleaded package (SON)?
 What is Small Outline Jleaded package (SOJ)?
 What is Quad Flat Package (QFP)?
 What is Quad Flat Jleaded package (QFJ)?
 What is Ball Grid Array (BGA)?
 What is Land Grid Array (LGA)?
 What is Pin Grid Array (PGA)?