What is Small Outline Package (SOP)?

There are various types of semiconductor and IC packages, such as Small Outline Package (SOP) and Quad Flat Package (QFP).

Regarding the "Small Outline Package (SOP)", this article will explain the information below.

Small Outline Package (SOP) Definition
Types of Small Outline Package (SOP)

Small Outline Package (SOP) Definition

SOP stands for "Small Outline Package".

Small Outline Package (SOP) is a gull wing (L-shaped) package with leads coming out of two sides of the package.

The pin pitch of the Small Outline Package (SOP) is 50 mils (1.27mm).

The number after SOP indicates the number of pins. For example, SOP8 means a 8-pin SOP.

The "package mounting height", "pin pitch", etc. change depending on the English letter in front of the SOP.

For example, "L" means that the package installation height L is "1.20mm<L≤1.70mm". Therefore, "LSOP" with "L" in front of SOP means SOP with a package installation height of "1.20mm<L≤1.70mm".

Difference between "SOP" and "SOIC"

In packages with a pin pitch of 1.27mm, those with a JEITA standard are Small Outline Package (SOP) and those with a JEDEC standard are Small Outline Integrated Circuit (SOIC). Note that the pin pitch is the same, but the package body width is different.

SOIC is also sometimes referred to as "Small Outline L-leaded package (SOL)" or "SO".

Difference between "SOP" and "QFP"

The package name changes depending on whether the gull wing (L-shaped) leads exit from two sides or four sides of the package.

Leads coming out of two sides: Small Outline Package (SOP)
Leads coming out of four sides: Quad Flat Package (QFP)

The following article explains the "Quad Flat Package (QFP)" in detail. If you are interested, please check it out from the link below.

: What is Quad Flat Package (QFP)?
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Difference between "SOP", "SOJ", and "SON"

The package name changes depending on whether the leads coming out of the two sides of the package are gull wing (L-shaped) leads, J-shaped leads, or electrode pads.

Gull-wing (L-shaped) lead: Small Outline Package (SOP)
J-shaped lead: Small Outline J-leaded package (SOJ)
Electrode pad: Small Outline Non-leaded package (SON)

The following article explains "Small Outline J-leaded package (SOJ)" and "Small Outline Non-leaded package (SON)" in detail. If you are interested, please check it out from the link below.

: What is Small Outline J-leaded package (SOJ)?
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: What is Small Outline Non-leaded package (SON)?
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Types of Small Outline Package (SOP)

SSOP

The "S" in front of SOP stands for "Shrink".

Therefore, "Shrink Small Outline Package (SSOP)" is a SOP with a shrunk pin pitch. The same concept applies to other basic packages (DIP, ZIP, PGA, etc.).

SSOP has pin pitches of 1.0 mm, 0.8 mm, 0.65 mm, and 0.5 mm. Thus, since there are multiple pin pitches, it is always necessary to confirm the pin pitch in the datasheet.

SSOP has 5 to 50 pins,

Supplement

SSOP is widely used as small surface-mount packages.

MSOP

Mini Small Outline Package or Micro Small Outline Package (MSOP) is an SOP with a pin pitch of 0.65mm or 0.5mm.

Different manufacturers use different designations: Analog Devices uses the term micro SOIC, Maxim uses SO/uMAX, and National Semiconductor uses MiniSO.

QSOP

Quarter Small Outline Package (QSOP) is an SOP with a pin pitch of 25mils(0.635mm).

LSOP

The "L" in front of SOP means that the package installation height L is "1.20mm < L ≤ 1.70mm".

Therefore, "Low-Profile Small Outline Package (LSOP)" is an SOP with a package installation height of "1.20mm < L ≤ 1.70mm".

LSSOP

The "L" in front of SSOP means that the package installation height L is "1.20mm < L ≤ 1.70mm".

Therefore, "Low-Profile Shrink Small Outline Package (LSSOP)" is an SSOP with a package installation height of "1.20mm < L ≤ 1.70mm".

TSOP

The "T" in front of SOP means that the package installation height L is "1.00mm < L ≤ 1.20mm".

Therefore, "Thin-Small Outline Package (TSOP)" is an SOP with a package installation height of "1.00mm < L ≤ 1.20mm".

TSOP has 24 to 64 pins and is used for memory components.

TSOP is available in Type I and Type II as shown below.

TSOP Type

Type I TSOP
- Type I TSOP has lead terminals attached to the short side of the package (pin pitch: 0.6 mm, 0.55 mm, 0.5 mm)
Type II TSOP
- Type II TSOP has lead terminals attached to the long side of the package (pin pitch: 1.27 mm)

TSSOP

The "T" in front of SSOP means that the package installation height L is "1.00mm < L ≤ 1.20mm".

Therefore, "Thin-Shrink Small Outline Package (TSSOP)" is an SSOP with a package installation height of "1.00mm < L ≤ 1.20mm".

TSSOP has pin pitches of 0.65 mm and 0.5 mm. TSSOP has 24 to 64 pins.

UTSOP

Ultra-Thin Small Outline Package or Micro Small Outline Package (UTSOP) is a SOP with a package installation height of 0.45mm.

HSOP

The "H" in front of SOP stands for "with heat sink".

Therefore, "HSOP" means a "SOP with heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HTSSOP

The "H" in front of TSSOP stands for "with heat sink".

Therefore, "HTSSOP" means a "TSSOP with heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HLSOP

The "H" in front of LSOP stands for "with heat sink".

Therefore, "HLSOP" means a "LSOP with heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

P-SOP

The "P-" in front of SOP stands for "plastic".

Therefore, "Plastic SOP (P-SOP)" means a "SOP whose package material is plastic".

C-SOP

The "C-" in front of SOP stands for "ceramic".

Therefore, "Ceramic SOP (C-SOP)" means a "SOP whose package material is ceramic".

G-SOP

The "G-" in front of SOP stands for "glass sealed ceramic".

Therefore, "Glass sealed ceramic SOP (G-SOP)" means a "SOP whose package material is glass sealed ceramic".

Summary

In this article, the following information on the "Small Outline Package (SOP)" was explained.

Small Outline Package (SOP) Definition
Types of Small Outline Package (SOP)

Thank you for reading.

The packages of semiconductors (IC and transistor) other than "Small Outline Package (SOP)" described in this article are explained in detail in the following article. If you are interested, please check it out from the link below.