What is Pin Grid Array (PGA)?

There are various types of semiconductor and IC packages, such as Pin Grid Array (PGA) and Ball Grid Array (BGA).

Regarding the "BGA (Ball Grid Array)", this article will explain the information below.

Pin Grid Array (PGA) Definition
Types of Pin Grid Array (PGA)

Pin Grid Array (PGA) Definition

PGA stands for "Pin Grid Array".

Pin Grid Array (PGA) is a package in which the pins are arranged in a grid pattern on the bottom of the package.

Pin Grid Array (PGA) pin pitch is typically 2.54mm (100 mils).

Pin Grid Arrays (PGA) may have more than 400 pins.

The "package material" is changed by adding an English letter in front of PGA.

Supplement

Depending on the package material, there are plastic PGA (P-PGA) and ceramic PGA (C-PGA).
Until the development of surface-mountable BGA, PGA was the mainstream high-pin-count package for CPUs and other components used in PCs. Today, plastic PGA (P-PGA) is rarely used. Ceramic PGA (C-PGA) is sometimes used in some high-end applications (e.g., high-speed and large-scale logic LSIs).
When the package material is not specifically indicated, it is often a ceramic PGA (C-PGA).
Plastic PGA (P-PGA) is less expensive.

Difference between "PGA", "LGA", and "BGA"

The package name changes depending on whether the grid array on the bottom of the package is pins, lands, or solder balls.

Pins: Pin Grid Array (PGA)
Lands: Land Grid Array (LGA)
Solder balls: Ball Grid Array (BGA)

The following article explains "Land Grid Array (LGA)" and "Ball Grid Array (BGA)" in detail. If you are interested, please check it out from the link below.

: What is Land Grid Array (LGA)?
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: What is Ball Grid Array (BGA)?
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Types of Pin Grid Array (PGA)

SPGA

The "S" in front of PGA stands for "Shrink".

Therefore, the Shrink Pin Grid Array (SPGA) is a PGA with a shrunk pin pitch. The same concept applies to other basic packages (SOP, DIP, ZIP, etc.).

IPGA

The "I" in front of PGA stands for "Interstitial.

Therefore, "Interstitial Pin Grid Array (IPGA)" means PGA with package terminals that are not grid-shaped (e.g., staggered pattern).

HPGA

The "H" in front of PGA stands for "Heat sink".

Therefore, "HPGA" means a "PGA with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

P-PGA

The "P-" in front of PGA stands for "Plastic".

Therefore, "Plastic BGA (P-BGA)" means a "PGA whose package material is plastic".

C-PGA

The "C-" in front of PGA stands for "Ceramic".

Therefore, "Ceramic PGA (C-PGA)" means a "PGA whose package material is ceramic".

G-PGA

The "G-" in front of PGA stands for "Glass sealed ceramic".

Therefore, "Glass sealed ceramic PGA (G-PGA)" means a "PGA whose package material is ceramic".

Summary

In this article, the following information on the "Pin Grid Array (PGA)" was explained.

Pin Grid Array (PGA) Definition
Types of Pin Grid Array (PGA)

Thank you for reading.

The packages of semiconductors (IC and transistor) other than "Pin Grid Array (PGA)" described in this article are explained in detail in the following article. If you are interested, please check it out from the link below.