What is Small Outline Non-leaded package (SON)?

There are various types of semiconductor and IC packages, such as Small Outline Non-leaded package (SON) and Small Outline Package (SOP).

Regarding the "Small Outline Non-leaded package (SON)", this article will explain the information below.

Small Outline Non-leaded package (SON) Definition
Types of Small Outline Non-leaded package (SON)

Small Outline Non-leaded package (SON) Definition

SON stands for "Small Outline Non-leaded package".

Small Outline Non-leaded package (SON) is a package that has no leads but instead has electrode pads as connection terminals. The electrode pads protrude from two sides of the package.

Since Small Outline Non-leaded package (SON) has no leads, the package can be made almost the same size as the chip size.

The "package mounting height", "pin pitch", etc. change depending on the English letter in front of the SON.

For example, "L" means that the package installation height L is "1.20mm<L≤1.70mm". Therefore, "LSON" with "L" in front of SON means SON with a package installation height of "1.20mm<L≤1.70mm".

Difference between "SON" and "QFN"

The package name changes depending on whether the electrode pads exit from two sides or four sides of the package.

Leads coming out of two sides: Small Outline Non-leaded package (SON)
Leads coming out of four sides: Quad Flat Non-leaded package (QFN)

The following article explains the "Quad Flat Non-leaded package (QFN)" in detail. If you are interested, please check it out from the link below.

: What is Quad Flat Non-leaded package (QFN)?
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Difference between "SOP", "SOJ", and "SON"

The package name changes depending on whether the leads coming out of the two sides of the package are gull wing (L-shaped) leads, J-shaped leads, or electrode pads.

Gull-wing (L-shaped) lead: Small Outline Package (SOP)
J-shaped lead: Small Outline J-leaded package (SOJ)
Electrode pad: Small Outline Non-leaded package (SON)

The following article explains "Small Outline Package (SOP)" and "Small Outline J-leaded package (SOJ)" in detail. If you are interested, please check it out from the link below.

: What is Small Outline Package (SOP)?
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: What is Small Outline J-leaded package (SOJ)?
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Types of Small Outline Non-leaded package (SON)

LSON

The "L" in front of SON means that the package installation height L is "1.20mm < L ≤ 1.70mm".

Therefore, "Low-Profile Small Outline Non-leaded package (LSON)" is a SON with a package installation height of "1.20mm < L ≤ 1.70mm".

TSON

The "T" in front of SON means that the package installation height T is "1.00mm < T ≤ 1.20mm".

Therefore, "Thin Small Outline Non-leaded package (TSON)" is a SON with a package installation height of "1.00mm < T ≤ 1.20mm".

VSON

The "V" in front of SON means that the package installation height V is "0.80mm < V ≤ 1.00mm".

Therefore, "Very-thin Small Outline Non-leaded package (VSON)" is a SON with a package installation height of "0.80mm < V ≤ 1.00mm".

WSON

The "W" in front of SON means that the package installation height W is "0.65mm < W ≤ 0.80mm".

Therefore, "Very-Very-thin Small Outline Non-leaded package (WSON)" is a SON with a package installation height of "0.65mm < W ≤ 0.80mm".

USON

The "U" in front of SON means that the package installation height U is "0.50mm < U ≤ 0.65mm".

Therefore, "Ultra-thin Small Outline Non-leaded package (USON)" is a SON with a package installation height of "0.50mm < U ≤ 0.65mm"

XSON

The "X" in front of SON means that the package installation height X is "X ≤ 0.50mm".

Therefore, "Extra thin Small Outline Non-leaded package (XSON)" is a SON with a package installation height of "X ≤ 0.50mm"

HSON

The "H" in front of SON stands for "with heat sink".

Therefore, "HSON" means a "SON with heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HLSON

The "H" in front of LSON stands for "with heat sink".

Therefore, "HLSON" means a "LSON with heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HTSON

The "H" in front of TSON stands for "with heat sink".

Therefore, "HTSON" means a "TSON with heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HVSON

The "H" in front of VSON stands for "with heat sink".

Therefore, "HVSON" means a "VSON with heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HWSON

The "H" in front of WSON stands for "with heat sink".

Therefore, "HWSON" means a "WSON with heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HUSON

The "H" in front of USON stands for "with heat sink".

Therefore, "HUSON" means a "USON with heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HXSON

The "H" in front of XSON stands for "with heat sink".

Therefore, "HXSON means a "XSON with heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

P-SON

The "P-" in front of SON stands for "plastic".

Therefore, "Plastic SON (P-SON)" means a "SON whose package material is plastic".

C-SON

The "C-" in front of SON stands for "ceramic".

Therefore, "Ceramic SON (C-SON)" means a "SON whose package material is ceramic".

Summary

In this article, the following information on the "Small Outline Non-leaded package (SON)" was explained.

Small Outline Non-leaded package (SON) Definition
Types of Small Outline Non-leaded package (SON)

Thank you for reading.

The packages of semiconductors (IC and transistor) other than "Small Outline Non-leaded package (SON)" described in this article are explained in detail in the following article. If you are interested, please check it out from the link below.