What is Land Grid Array (LGA)?

There are various types of semiconductor and IC packages, such as Land Grid Array (LGA) and Ball Grid Array (BGA).

Regarding the "Land Grid Array (LGA)", this article will explain the information below.

Land Grid Array (LGA) Definition
Types of Land Grid Array (LGA)

Land Grid Array (LGA) Definition

LGA stands for "Land Grid Array".

Land Grid Array (LGA) is a package in which the lands are arranged in a grid pattern on the bottom of the package.

Land Grid Array (LGA) is suitable for high-speed and high-frequency operation because of its small terminal parasitic inductance.

Unlike Ball Grid Array (BGA), Land Grid Array (LGA) can be mounted using sockets. There are special sockets that are mounted by pressing against a kenzan-shaped electrode.

Also, since the terminals of Land Grid Array (LGA) are lands, the mounting height can be reduced compared to that of Ball Grid Array (BGA).

The "package mounting height", "pin pitch", etc. change depending on the English letter in front of the LGA.

For example, "L" means that the package installation height L is "1.20mm < L ≤ 1.70mm". Therefore, "LLGA" with "L" in front of LGA means LGA with a package installation height of "1.20mm < L ≤ 1.70mm".

Difference between "PGA", "LGA", and "BGA"

The package name changes depending on whether the grid array on the bottom of the package is pins, lands, or solder balls.

Pins: Pin Grid Array (PGA)
Lands: Land Grid Array (LGA)
Solder balls: Ball Grid Array (BGA)

The following article explains "Pin Grid Array (PGA)" and "Ball Grid Array (BGA)" in detail. If you are interested, please check it out from the link below.

: What is Pin Grid Array (PGA)?
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: What is Ball Grid Array (BGA)?
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Types of Land Grid Array (LGA)

FLGA

The "F" in front of LGA stands for "Fine pitch".

The "F" makes the pin pitch shorter as shown below.

About Pin Pitch

When the basic package is BGA or LGA (FBGA or FLGA)
- Pin pitch is 0.8 mm or less
When the basic package is QFP (FQFP)
- Pin pitch is 0.5 mm or less

Therefore, "Fine-pitch Land Grid Array (FLGA)" means LGA with a pin pitch of 0.8 mm or less.

ILGA

The "I" in front of LGA stands for "Interstitial.

Therefore, "Interstitial Land Grid Array (ILGA)" means LGA with package terminals that are not grid-shaped (e.g., staggered pattern).

LLGA

The "L" in front of LGA means that the package installation height L is "1.20mm < L ≤ 1.70mm".

Therefore, "Low-Profile Land Grid Array (LLGA)" is a LGA with a package installation height of "1.20mm < L ≤ 1.70mm".

LFLGA

The "L" in front of FLGA means that the package installation height L is "1.20mm < L ≤ 1.70mm".

Therefore, "Low-Profile Fine-pitch Land Grid Array (LFLGA)" is a FLGA with a package installation height of "1.20mm < L ≤ 1.70mm".

TLGA

The "T" in front of LGA means that the package installation height T is "1.00mm < T ≤ 1.20mm".

Therefore, "Thin Land Grid Array (TLGA)" is a LGA with a package installation height of "1.00mm < T ≤ 1.20mm".

TFLGA

The "T" in front of FLGA means that the package installation height T is "1.00mm < T ≤ 1.20mm".

Therefore, "Thin Fine-pitch Land Grid Array (TFLGA)" is a FLGA with a package installation height of "1.00mm < T ≤ 1.20mm".

VLGA

The "V" in front of LGA means that the package installation height V is "0.80mm < V ≤ 1.00mm".

Therefore, "Very thin Land Grid Array (VLGA)" is a LGA with a package installation height of "0.80mm < V ≤ 1.00mm".

VFLGA

The "V" in front of FLGA means that the package installation height V is "0.80mm < V ≤ 1.00mm".

Therefore, "Very thin Fine-pitch Land Grid Array (VFLGA)" is a FLGA with a package installation height of "0.80mm < V ≤ 1.00mm".

WLGA

The "W" in front of LGA means that the package installation height W is "0.65mm < W ≤ 0.80mm".

Therefore, "Very-Very thin Land Grid Array (WLGA)" is a LGA with a package installation height of "0.65mm < W ≤ 0.80mm".

WFLGA

The "W" in front of FLGA means that the package installation height W is "0.65mm < W ≤ 0.80mm".

Therefore, "Very-Very thin Fine-pitch Land Grid Array (WFLGA)" is a FLGA with a package installation height of "0.65mm < W ≤ 0.80mm".

ULGA

The "U" in front of LGA means that the package installation height U is "0.50mm < U ≤ 0.65mm".

Therefore, "Ultra-thin Land Grid Array (ULGA)" is a LGA with a package installation height of "0.50mm < U ≤ 0.65mm"

UFLGA

The "U" in front of FLGA means that the package installation height U is "0.50mm < U ≤ 0.65mm".

Therefore, "Ultra-thin Fine-pitch Land Grid Array (UFLGA)" is a FLGA with a package installation height of "0.50mm < U ≤ 0.65mm"

XLGA

The "X" in front of LGA means that the package installation height X is "X ≤ 0.50mm".

Therefore, "Extra thin Land Grid Array (XLGA)" is a LGA with a package installation height of "X ≤ 0.50mm"

XFLGA

The "X" in front of FLGA means that the package installation height X is "X ≤ 0.50mm".

Therefore, "Extra thin Fine-pitch Land Grid Array (XFLGA)" is a FLGA with a package installation height of "X ≤ 0.50mm"

HLGA

The "H" in front of LGA stands for "Heat sink".

Therefore, "LGA with Heat sink (HLGA)" means a "LGA with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HLLGA

The "H" in front of LLGA stands for "Heat sink".

Therefore, "HLLGA" means a "LLGA with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HTLGA

The "H" in front of TLGA stands for "Heat sink".

Therefore, "HTLGA" means a "TLGA with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HVLGA

The "H" in front of VLGA stands for "Heat sink".

Therefore, "HVLGA" means a "VLGA with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HWLGA

The "H" in front of WLGA stands for "Heat sink".

Therefore, "HWLGA" means a "WLGA with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HULGA

The "H" in front of ULGA stands for "Heat sink".

Therefore, "HULGA" means a "ULGA with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HXLGA

The "H" in front of XLGA stands for "Heat sink".

Therefore, "HXLGA" means a "XLGA with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

P-LGA

The "P-" in front of LGA stands for "Plastic".

Therefore, "Plastic LGA (P-LGA)" means a "LGA whose package material is plastic".

C-LGA

The "C-" in front of LGA stands for "Ceramic".

Therefore, "Ceramic LGA (C-LGA)" means a "LGA whose package material is ceramic".

S-FLGA

The "S-" in front of FLGA stands for "Silicon".

Therefore, "Silicon FLGA (S-FLGA)" means a "FLGA whose package material is silicon".

Summary

In this article, the following information on the "Land Grid Array (LGA)" was explained.

Land Grid Array (LGA) Definition
Types of Land Grid Array (LGA)

Thank you for reading.

The packages of semiconductors (IC and transistor) other than "Land Grid Array (LGA)" described in this article are explained in detail in the following article. If you are interested, please check it out from the link below.