engineer

There are various types of semiconductor and IC packages, such as Pin Grid Array (PGA) and Ball Grid Array (BGA). Regarding the "BGA (Ball Grid Array)", this article will explain the information below. Pin Grid Array (PGA) Definition Types of Pin Grid Array (PGA) Pin Grid Array (PGA) Definition PGA stands for "Pin Grid Array". Pin Grid Array (PGA) is a package in which the pins are arranged in a grid pattern on the bottom of the package. Pin Grid Array (PGA) pin pitch is typically 2.54mm (100 mils). Pin Grid Arrays (PGA) may have more than 400 pins. The ...

There are various types of semiconductor and IC packages, such as Ball Grid Array (BGA) and Pin Grid Array (PGA). Regarding the "Ball Grid Array (BGA)", this article will explain the information below. Ball Grid Array (BGA) Definition Types of Ball Grid Array (BGA) Ball Grid Array (BGA) Definition BGA stands for "Ball Grid Array". Ball Grid Array (BGA) is a package in which the solder balls are arranged in a grid pattern on the bottom of the package. There are various pin pitches such as 1.27mm, 1.0mm, 0.8mm, 0.75mm, 0.65mm, 0.5mm,and 0.4mm. The "package mounting height", "pin pitch", etc. ...

There are various types of semiconductor and IC packages, such as Quad Flat J-leaded package (QFJ) and Small Outline J-leaded package (SOJ). Regarding the "Quad Flat J-leaded package (QFJ)", this article will explain the information below. Quad Flat J-leaded package (QFJ) Definition Types of Quad Flat J-leaded package (QFJ) Quad Flat J-leaded package (QFJ) Definition QFJ stands for "Quad Flat J-leaded package". Quad Flat J-leaded package (QFJ) is a J-leaded package with leads coming out of four sides of the package. Compared to Quad Flat Package (QFP), which has a gull wing (L-shaped) lead shape, Quad Flat J-leaded package (QFJ), ...

There are various types of semiconductor and IC packages, such as Quad Flat Non-leaded package (QFN) and Small Outline Package (SOP). Regarding the "Quad Flat Non-leaded package (QFN)", this article will explain the information below. Quad Flat Non-leaded package (QFN) Definition Types of Quad Flat Non-leaded package (QFN) Quad Flat Non-leaded package (QFN) Definition QFN stands for "Quad Flat Non-leaded package". Quad Flat Non-leaded package (QFN) is a package that has no leads but instead has electrode pads as connection terminals. The electrode pads protrude from four sides of the package. Since Quad Flat Non-leaded package (QFN) has no leads, ...

There are various types of semiconductor and IC packages, such as Quad Flat Package (QFP) and Small Outline Package (SOP). Regarding the "Quad Flat Package (QFP)", this article will explain the information below. Quad Flat Package (QFP) Definition Types of Quad Flat Package (QFP) Quad Flat Package (QFP) Definition QFP stands for "Quad Flat Package". Quad Flat Package (QFP) is a gull wing (L-shaped) package with leads coming out of four sides of the package. There are various pin pitches such as 1.0mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, and 0.3mm. Note that as the pin pitch becomes narrower, the lead pins ...

There are various types of semiconductor and IC packages, such as Small Outline J-leaded package (SOJ) and Small Outline Package (SOP). Regarding the "Small Outline J-leaded package (SOJ)", this article will explain the information below. Small Outline J-leaded package (SOJ) Definition Types of Small Outline J-leaded package (SOJ) Small Outline J-leaded package (SOJ) Definition SOJ stands for "Small Outline J-leaded package". Small Outline J-leaded package (SOJ) is a J-leaded package with leads coming out of two sides of the package. Compared to Small Outline Package (SOP), which has a gull wing (L-shaped) lead shape, Small Outline J-leaded package (SOJ), which ...

There are various types of semiconductor and IC packages, such as Small Outline Non-leaded package (SON) and Small Outline Package (SOP). Regarding the "Small Outline Non-leaded package (SON)", this article will explain the information below. Small Outline Non-leaded package (SON) Definition Types of Small Outline Non-leaded package (SON) Small Outline Non-leaded package (SON) Definition SON stands for "Small Outline Non-leaded package". Small Outline Non-leaded package (SON) is a package that has no leads but instead has electrode pads as connection terminals. The electrode pads protrude from two sides of the package. Since Small Outline Non-leaded package (SON) has no leads, ...

There are various types of semiconductor and IC packages, such as Small Outline Package (SOP) and Quad Flat Package (QFP). Regarding the "Small Outline Package (SOP)", this article will explain the information below. Small Outline Package (SOP) Definition Types of Small Outline Package (SOP) Small Outline Package (SOP) Definition SOP stands for "Small Outline Package". Small Outline Package (SOP) is a gull wing (L-shaped) package with leads coming out of two sides of the package. The pin pitch of the Small Outline Package (SOP) is 50 mils (1.27mm). The number after SOP indicates the number of pins. For example, SOP8 means a ...

There are various types of semiconductor and IC packages, such as Zig-zag In-line Package (ZIP) and SIP (Single In-line Package). Regarding the "Zig-zag In-line Package (ZIP)", this article will explain the information below. Zig-zag In-line Package (ZIP) Definition Types of Zig-zag In-line Package (ZIP) Zig-zag In-line Package (ZIP) Definition ZIP stands for "Zig-zag In-line Package". Zig-zag In-line Package (ZIP) is a package in which the leads come out of one side of the package, the leads alternately zig-zagged out, and the package is for insert mounting. It is the same as Single In-line Package (SIP) in that the leads come ...

There are various types of semiconductor and IC packages, such as Dual In-line Package (DIP) and SIP (Single In-line Package). Regarding the "Dual In-line Package (DIP)", this article will explain the information below. Dual In-line Package (DIP) Definition Types of Dual In-line Package (DIP) Dual In-line Package (DIP) Definition DIP stands for "Dual In-line Package". Dual In-line Package (DIP) is a package in which the leads come out of two sides of the package, the leads extend downward from the two long sides of the package, and the package is for insert mounting. Dual In-line Package (DIP) is available in ...