What is Quad Flat Package (QFP)?

There are various types of semiconductor and IC packages, such as Quad Flat Package (QFP) and Small Outline Package (SOP).

Regarding the "Quad Flat Package (QFP)", this article will explain the information below.

Quad Flat Package (QFP) Definition
Types of Quad Flat Package (QFP)

Quad Flat Package (QFP) Definition

QFP stands for "Quad Flat Package".

Quad Flat Package (QFP) is a gull wing (L-shaped) package with leads coming out of four sides of the package.

There are various pin pitches such as 1.0mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, and 0.3mm. Note that as the pin pitch becomes narrower, the lead pins bend more easily.

The number after QFP indicates the number of pins. For example, QFP44 means a 44-pin QFP.

The "package mounting height", "pin pitch", etc. change depending on the English letter in front of the QFP.

For example, "L" means that the package installation height L is "1.20mm < L ≤ 1.70mm". Therefore, "LQFP" with "L" in front of QFP means QFP with a package installation height of "1.20mm < L ≤ 1.70mm".

Difference between "SOP" and "QFP"

The package name changes depending on whether the gull wing (L-shaped) leads exit from two sides or four sides of the package.

Leads coming out of two sides: Small Outline Package (SOP)
Leads coming out of four sides: Quad Flat Package (QFP)

The following article explains the "Small Outline Package (SOP)" in detail. If you are interested, please check it out from the link below.

: What is Small Outline Package (SOP)?
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Difference between "QFP", "QFJ", and "QFN"

The package name changes depending on whether the leads coming out of the four sides of the package are gull wing (L-shaped) leads, J-shaped leads, or electrode pads.

Gull-wing (L-shaped) lead: Quad Flat Package (QFP)
J-shaped lead: Quad Flat J-leaded package (QFJ)
Electrode pad: Quad Flat Non-leaded package (QFN)

The following article explains "Quad Flat J-leaded package (QFJ)" and "Quad Flat Non-leaded package (QFN)" in detail. If you are interested, please check it out from the link below.

: What is Quad Flat J-leaded package (QFJ)?
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: What is Quad Flat Non-leaded package (QFN)?
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Types of Quad Flat Package (QFP)

BQFP

The "B" in front of QFP stands for "Bumper".

Therefore, "BQFP" means QFP with a Bumper.

GQFP

The "G" in front of QFP stands for "Guard ring".

Therefore, "GQFP" means QFP with a Guard ring.

FQFP

The "F" in front of QFP stands for "Fine pitch".

The "F" makes the pin pitch shorter as shown below.

About Pin Pitch

When the basic package is BGA or LGA (FBGA or FLGA)
- Pin pitch is 0.8 mm or less
When the basic package is QFP (FQFP)
- Pin pitch is 0.5 mm or less

Therefore, "Fine-pitch Quad Flat Package (FQFP)" means QFP with a pin pitch of 0.5 mm or less.

LQFP

The "L" in front of QFP means that the package installation height L is "1.20mm < L ≤ 1.70mm".

Therefore, "Low-Profile Quad Flat Package (LQFP)" is a QFP with a package installation height of "1.20mm < L ≤ 1.70mm".

TQFP

The "T" in front of QFP means that the package installation height T is "1.00mm < T ≤ 1.20mm".

Therefore, "Thin Quad Flat Package (TQFP)" is a QFP with a package installation height of "1.00mm < T ≤ 1.20mm".

Thin Quad Flat Package (TQFP) has about 44 to 120 pins and is used for memory components.

There are various types of Thin Quad Flat Package (TQFP) pin pitch such as 0.8mm, 0.65mm, 0.5mm, 0.4mm, etc.

VQFP

The "V" in front of QFP means that the package installation height V is "0.80mm < V ≤ 1.00mm".

Therefore, "Very thin Quad Flat Package (VQFP)" is a QFP with a package installation height of "0.80mm < V ≤ 1.00mm".

WQFP

The "W" in front of QFP means that the package installation height W is "0.65mm < W ≤ 0.80mm".

Therefore, "Very-Very thin Quad Flat Package (WQFP)" is a QFP with a package installation height of "0.65mm < W ≤ 0.80mm".

HQFP

The "H" in front of QFP stands for "Heat sink".

Therefore, "HQFP" means a "QFP with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HLQFP

The "H" in front of LQFP stands for "Heat sink".

Therefore, "HLQFP" means a "LQFP with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

HTQFP

The "H" in front of TQFP stands for "Heat sink".

Therefore, "HTQFP" means a "TQFP with Heat sink". A heat-dissipating surface called a thermal pad is provided on the board mounting side surface.

P-QFP

The "P-" in front of QFP stands for "Plastic".

Therefore, "Plastic QFP (P-QFP)" means a "QFP whose package material is Plastic".

C-QFP

The "C-" in front of QFP stands for "Ceramic".

Therefore, "Ceramic QFP (C-QFP)" means a "QFP whose package material is Ceramic".

G-QFP

The "G-" in front of QFP stands for "Glass sealed ceramic".

Therefore, "Glass sealed ceramic QFP (G-QFP)" means a "QFP whose package material is Glass sealed ceramic".

Summary

In this article, the following information on the "Quad Flat Package (QFP)" was explained.

Quad Flat Package (QFP) Definition
Types of Quad Flat Package (QFP)

Thank you for reading.

The packages of semiconductors (IC and transistor) other than "Quad Flat Package (QFP)" described in this article are explained in detail in the following article. If you are interested, please check it out from the link below.