There are various types of semiconductor and IC packages, such as Ball Grid Array (BGA) and Pin Grid Array (PGA). Regarding the "Ball Grid Array (BGA)", this article will explain the information below. Ball Grid Array (BGA) Definition Types of Ball Grid Array (BGA) Ball Grid Array (BGA) Definition BGA stands for "Ball Grid Array". Ball Grid Array (BGA) is a package in which the solder balls are arranged in a grid pattern on the bottom of the package. There are various pin pitches such as 1.27mm, 1.0mm, 0.8mm, 0.75mm, 0.65mm, 0.5mm,and 0.4mm. The "package mounting height", "pin pitch", etc. ...