Difference Between Through-hole, Blind Via, Buried Via, and Land

What is the difference between through-hole, blind via, buried via, and land?

Regarding the through-hole, blind via, buried via, and land, this article will explain the information below.

• Difference Between Through-hole, Blind Via, Buried Via, and Land

Through-hole

First, let us discuss through holes.

A through-hole is a hole where the inner surface of a substrate hole is copper plated and electrically connected.

There are two types of through holes as follows。

• Through-hole for electronic components
  • Holes through which terminals of electronic components are inserted for soldering
• Via hole
  • A hole for the purpose of conduction between layers of a substrate pattern

Next, "Through-hole for electronic components" and "Via hole" are explained.

Through-hole for electronic components

Through-hole for electronic components is holes into which terminals of electronic components are inserted for soldering.

Compared to via hole, through hole for electronic components is larger in diameter because they are used to insert electronic components.

Via Hole

A via Hole is a hole intended for conduction between layers of a board pattern. In other words, via holes are not holes into which electronic components are inserted.

In areas where a large amount of current flows between layers, the current that can flow is increased by increasing the number of via holes.

Types of Via Hole

There are different types of via holes for the purpose of interlayer conduction.

Broadly classified, there are the following two types.

• PTH: Plated Through Hole
  • A via hole that penetrates through all layers of a substrate.
• IVH: Interstitial Via Hole
  • A via hole that penetrates a portion of the substrate ("surface to inner layer" or "inner layer to inner layer").

There are also different types of Interstitial Via Hole(IVH), which can be broadly classified into the following two types

• BVH: Blind Via Hole
  • A via hole that penetrates the surface and inner layer of a substrate.
• BVH: Buried Via Hole
  • A via hole that penetrates between the inner layer and the inner layer of the substrate.

The following is a detailed explanation of "Plated Through Hole(PTH)", "Interstitial Via Hole(IVH)", "Blind Via Hole(BVH)", and "Buried Via Hole(BVH)" in turn.

Plated Through Hole(PTH)

Plated Through Hole(PTH) is via hole that penetrates all layers of a substrate.

Plated Through Hole(PTH) is created by drilling holes and through-hole plating (copper plating). Plated Through Hole(PTH) requires the smallest possible hole diameter to reduce the area occupied.

Interstitial Via Hole(IVH)

Interstitial Via Hole(IVH) is via hole that penetrates a portion of the substrate ("surface and inner layer" or "inner layer and inner layer").

As explained earlier, among Interstitial Via Hole (IVH), the via hole that penetrates the surface and inner layer of the substrate is called "Blind Via Hole(BVH)" and the via hole that penetrates the inner layer and inner layer of the substrate is called "Buried Via Hole(BVH)".

Blind Via Hole(BVH)

Blind Via Hole (BVH) is a via hole that penetrates the surface and inner layer of a substrate.

A Blind Via Hole (BVH) is a via that penetrates the surface and inner layer of a substrate, so that it is only visible on one side of the substrate. It is called a "Blind Via Hole (BVH)" because it is not visible from the other side.

Plated Through Hole (PTH) drilling is done with a drill, but Blind Via Hole (BVH) drilling is done with a laser instead of a drill.

Buried Via Hole(BVH)

A Buried Via Hole (BVH) is a via hole that penetrates the inner and outer layers of a substrate.

A Buried Via Hole (BVH) is a via that penetrates the inner and inner layers of a substrate and is therefore invisible from the surface of the substrate.

Like Blind Via Hole (BVH), drilling is done with a laser rather than a drill.

Some materials refer to Buried Via Hole (BVH) as "Interstitial Via Hole(IVH)".

Land

The land is the area where the leads of electronic components are soldered.

The diameter of the land is called the land diameter, and the inside diameter of the land is called the hole diameter.

In addition to round holes, there are also long holes and square holes in the land.

Summary

This article described the following information about through-hole, blind via, buried via, and land.

1. Difference Between Through-hole, Blind Via, Buried Via, and Land

Thank you for reading.